A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

433-440

DOI:

10.4028/www.scientific.net/KEM.257-258.433

Citation:

D.H. Lee et al., "A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process", Key Engineering Materials, Vols. 257-258, pp. 433-440, 2004

Online since:

February 2004

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$35.00

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