A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction

J.M. Park; Hae Do Jeong

doi:10.4028/www.scientific.net/KEM.257-258.459

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A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
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Abrasive Micromachining with a Multi-Axes Vibration Tool
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A Study of the Micro Pole Structure Fabrication and Application Technology by Micro End-Milling Process
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A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction
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An Investigation on the 3D Micromachining Techniques Based on a SPM
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Improvement of Corrosion Resistance and Mechanical Properties of the Biomaterial Ti-6Al-4V Alloy by ELID Grinding
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Micro-Polishing of Complex and Flat Parts Using a Chemical Oil Based ER Fluid
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Study on the Micro Machining of Si Wafer Using...

A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction

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Key Engineering Materials (Volumes 257-258)

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459-464

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.459

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Online since:

February 2004

Authors:

J.M. Park, Hae Do Jeong

Keywords:

Brittle Materials, Chemical Mechanical Micro Machining, Chemically Reacted Layer, Microcrack, Nanoindentation, Scratch Test

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