A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

459-464

DOI:

10.4028/www.scientific.net/KEM.257-258.459

Citation:

J.M. Park and H. D. Jeong, "A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction", Key Engineering Materials, Vols. 257-258, pp. 459-464, 2004

Online since:

February 2004

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$35.00

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