The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer

B.D. Liu; Jia Liang Guan; D.SH. Li; H.Q. Li

doi:10.4028/www.scientific.net/KEM.304-305.422

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Study on Wear Mode of Silicon Nitride Balls in Lapping Process
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The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer
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Kinematics of a 4-DOF Bipod Parallel Grinder
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 304-305The Experimental Study on Lapping and Polishing of...

The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer

Abstract:

The removal of redundant layer of deposited metal of the micro coils is one difficult problem in the fabricating of micro-mechanical electromagnetic relay. In view of the machining efficiency and quality, the paper introduced lapping and polishing technology. The paper also analyzed the characteristic of lapping and polishing and introduced the appropriate abrasives. Then the main procedures were presented and the measuring result was given in the paper. The surface roughness of the coil could satisfy the next layer fabricate requirements of the micro-mechanical electromagnetic relay. At last the paper concluded the optimized lapping and polishing parameters.

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Periodical:

Key Engineering Materials (Volumes 304-305)

Pages:

422-425

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.304-305.422

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Online since:

February 2006

Authors:

B.D. Liu, Jia Liang Guan, D.SH. Li, H.Q. Li

Keywords:

Lapping, Micro-Coil, Micro-Electromechanical System (MEMS), Polishing

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References

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