Effects of Incident Angle on Microstructure of Ni-Cr Film Deposited by PVD

Abstract:

A 2D kinetic Monte Carlo (KMC) simulation has been applied to study the microstructure of Ni-Cr film deposited by physical vapor deposition (PVD) for variable incident angle. In the KMC method, two phenomena were incorporated: adatom-surface collision and adatom diffusion, the interaction between atoms was described by embedded atom method and jumping energy was calculated by molecular statics calculations, initial location of adatom was located by Momentum Scheme. The results reveal that there exists critical incident angle, which is 35˚ for Ni-Cr thin film. When incident angle is less than 35˚, incident angle have less affect on surface roughness factor and packing density, compact films with smooth surface are obtained, their surface roughness factor is bellow 1.12 and packing density is more than 99.6%. However, when incident angle is more than 35˚, surface roughness factor increases quickly and packing density decreases sharply with incident angle increasing: surface roughness factor increase to 1.5 and 2.3 for incident angle of 45˚ and 60˚ respectively, packing density is below 99% and 96% accordingly. Which reveal that the self-shadowing effect emphasizes with incident angle increasing when the incident angle is more than 35˚.

• Periodical: Key Engineering Materials (Volumes 373-374)
• Pages: 184-187
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.373-374.184
• Online since: March 2008
• Authors: Ying Chun Shan, Jiu Jun Xu, Xiao Dong He, Ming Wei Li
• Keywords: Incident Angle, KMC Simulation, Ni-Cr Film

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