Advances in Abrasive Technology XI
Paper Title Page
Abstract: A novel method is reported for predicting the distribution of normal and tangential grinding forces in wheel and workpiece contact zone or...
Abstract: Single crystal MgO can be used as the substrates to deposit HTS films. The subsurface damage (SSD) generated in processing has great effect...
Abstract: Silicon wafer thinning process is meeting great challenges to fulfill requirements of ultra-thin IGBT for automotive applications....
Abstract: Ceramics has many advantages that cannot be substituted by metals, but its machining induced defects, such as crack and crater, are the...
Abstract: Aiming at solving the problems of wheel loading in dry grinding of Carbon/Epoxy composite materials, a novel electroplated grinding wheel...
Abstract: The elastic and/or plastic behaviors of glass quartz, the most popular optical material and a hard and brittle material, were studied...
Abstract: A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface...