Advances in Abrasive Technology XI

Papers
Book

Volumes 389-390

doi: 10.4028/www.scientific.net/KEM.389-390

Paper Title Page

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Preface

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone

Authors: Zhong De Shi, Madhusudhan Srinivasaraghavan, Helmi Attia

Abstract: A novel method is reported for predicting the distribution of normal and tangential grinding forces in wheel and workpiece contact zone or...

Study on the Subsurface Damage of Single Crystal MgO Substrates

Authors: Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia

Abstract: Single crystal MgO can be used as the substrates to deposit HTS films. The subsurface damage (SSD) generated in processing has great effect...

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Authors: J. Sasaki, T. Tsuruga, B.H. Soltani, Takahito Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya

Abstract: Silicon wafer thinning process is meeting great challenges to fulfill requirements of ultra-thin IGBT for automotive applications....

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

Authors: Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara

Abstract: Ceramics has many advantages that cannot be substituted by metals, but its machining induced defects, such as crack and crater, are the...

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

Authors: H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu

Abstract: Aiming at solving the problems of wheel loading in dry grinding of Carbon/Epoxy composite materials, a novel electroplated grinding wheel...

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool

Authors: Junichi Tamaki, Akihiko Kubo, Ji Wang Yan

Abstract: The elastic and/or plastic behaviors of glass quartz, the most popular optical material and a hard and brittle material, were studied...

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Authors: Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin

Abstract: A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface...