Joint Formation Mechanism and Strength in Resistance Microwelding of Brass Sheet to Fine Insulated Cu Wire

Abstract:

Resistance microwelding is an important microjoining process used in the fabrication of microelectronics, MEMS and medical devices. However, the process is infeasible in the situation of terminating insulated copper wire to metal sheet due to the hindrance of the insulation coating in common opposed configuration. To address this problem, a revised electrode configuration is used. The effect of main process parameters (welding current, weld time and electrode force) were investigated by detailed mechanical testing and metallurgical examinations. A bonding mechanism with several main process stages (wire cold collapse, coating melting and withdrawing, and solid-state bonding) was proposed.

• Periodical: Key Engineering Materials (Volumes 447-448)
• Pages: 461-465
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.447-448.461
• Online since: September 2010
• Authors: Bing Hua Mo, Zhong Ning Guo, Yuan Bo Li, Chang Liu
• Keywords: Bonding Mechanism, Insulated Wire, Joint Strength, Resistance Microwelding

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