Dynamic Characteristics Measurement of Silicon Micro-Cantilever in Low Temperature Environment

Dong Sheng She; Xiao Dong Wang; Xi Wen Zhang; Li Ding Wang

doi:10.4028/www.scientific.net/KEM.483.18

Paper Titles

Preface

Application of Ultrasonic Stress Relief in the Fabrication of SU-8 Micro Structure
p.3

Design and Empirical Study for Coner Compensation in 25% Wt TMAH Etching on (100) Silicon Wafers
p.9

Characterization of AlGaN/GaN Cantilevers Fabricated with Deep-Release Techniques
p.14

Dynamic Characteristics Measurement of Silicon Micro-Cantilever in Low Temperature Environment
p.18

Low Cost Fabrication of Micro Glass Cavities For MEMS Wafer Level and Hermetic Packaging
p.23

Study of Under Etching Characters of Si (100) in Surfactant Added TMAH
p.34

Design and System-Level Simulation of a Novel On-Chip Test Based on Macromodels
p.38

An Electrostatic Force Feedback Approach for Extending the Bandwidth of MEMS Vibratory Gyroscope
p.43

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Dynamic Characteristics Measurement of Silicon Micro-Cantilever in Low Temperature Environment

Abstract:

The dynamic testing system for MEMS in low temperature environment has been developed. A thermoelectric cooling refrigerator was utilized to generate the low temperature environment. The base excitation device was established using the piezoelectric ceramic as the driving source. A vacuum chamber was designed to protect the micro-structure from the humid air. Through the base impact excitation, the resonance frequencies are obtained by analyzing the impulse response signals. The frequency response of micro-cantilever was obtained by using both BIST method and laser Doppler vibrometer. The dynamic testing experiments for the silicon micro-cantilever were carried out from -50°C to room temperature. The result shows that the resonance frequency slightly increases with the decreasing temperature. The measurement device is effective to carry out dynamic testing of microstructure from -50°C to room temperature.