Simulation of Injection Molding of Ultra-Thin Light Guide Plate with Hemispherical Microstructures

Abstract:

Micro injection molding is used widely owing to its high accuracy, high production efficiency, low cost and can fabricate products with complex structures. For optical components, the residual stress is a main element for quality. In this research, the light guide plate is used as the study object. The light guide plate was designed by software Pro-E, and was simulated by Moldflow for filling process. Orthogonal method was used in this research. The most important factor that affects residual stress level is mold temperature. The level of the different process parameters on residual stress are mold temperature, packing time, packing pressure and melt temperature.

• Periodical: Key Engineering Materials (Volume 503)
• Pages: 222-226
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.503.222
• Online since: February 2012
• Authors: Peng Wei Dong, Zhong Li Zhao, Da Ming Wu, Ya Yun Zhang, Jian Zhuang
• Keywords: Light Guide Plate, Micro-Injection Molding, Parameter, Residual Stress, Simulation

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