An In Situ Measuring Method for Young's Modulus of a MEMS Film Base on Resonance Frequency

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Abstract:

Large-scale measurement of material property is not suit for the MEMS thin-film. Research the in-situ measuring method for material property of the MEMS thin-film is urgently. A center-anchored circular plate is adopted as the test structure here. The resonance frequency of the circular plate is measured to extract the Young’s modulus of a MEMS thin-film. The accuracy of this non-contact in-situ measuring method has been verified by CoventorWare. The inferences of the stress gradient have been analyzed. The advantages of the test structure and the measuring method present here also have been discussed.

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308-311

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February 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] R. Liu, H. Wang, X P. Li, et al: A Micro-tensile Method for Measuring Mechanical Properties of MEMS Material, Micromechanics and Microgineering, Vol. 18, (2008) pp.65-67.

Google Scholar

[2] Y C. Hu, C S. Wei, C C. Hsiao, et al: Extracting the Young's Modulus and Stress Gradient of Thin Films from the Pull-in Voltage of a Micro Curled Cantilever Beam, Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, (2007).

DOI: 10.1109/nems.2007.352026

Google Scholar

[3] H. Rong, H. Chen: Numerical Method for Extracting Young's Modulus and Residual Stress of a MEMS Film, Sensors and Actuators, Vol. 21 (2008) pp.431-434.

Google Scholar

[4] H. Chen, H. Rong, M. Wang: An In-Situ Measuring Method for Stress Gradient of a MEMS Film, Advanced Material Research, Vol. 60-61, (2009) pp.357-360.

DOI: 10.4028/www.scientific.net/amr.60-61.357

Google Scholar

[5] S D. Senturia: Micro System Design, Electronic industry publishing company, (2004) pp.124-162.

Google Scholar

[6] G J. McShane, D F. Moore, T J. Lu, et al: Young's Modulus Measurement of Thin-film Materials Using Micro-cantilevers, Micromechanics and Microgineering, Vol. 16, (2006) p.1926-(1934).

DOI: 10.1088/0960-1317/16/10/003

Google Scholar

[7] J L. Meng, R S. Chen: Effect of Gradient Residual Stress on Adhesion for a Center-anchored Circular plate and its underlying Substrate, Sensors and Actuator, (2004) pp.109-117.

DOI: 10.1016/j.sna.2004.04.042

Google Scholar

[8] L S. Fan, R S. Muller, W. Yun, et al: Spiral Microstructures for the Measurement of Average Strain Gradients in Thin Films, Micro Electro Mechanical Systems. IEEE. (1990) pp.177-180.

DOI: 10.1109/memsys.1990.110272

Google Scholar