Direct Numerical Simulations of Electrophoretic Deposition of Charged Colloidal Suspensions

Jae Sung Park; David Saintillan

doi:10.4028/www.scientific.net/KEM.507.47

Paper Titles

Pulse Electric Fields for EPD of Thermal Barrier Coatings
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Triethanolamine as an Additive in the Electrophoretic Deposition of TiTe₃O₈ Thick Films
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Electrophoretic Deposition onto Ionic Liquid Layers
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AC Electrophoresis, a New Technique for Deposition of Ceramic Nanoparticles; Introduction, Application and Mechanism
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Direct Numerical Simulations of Electrophoretic Deposition of Charged Colloidal Suspensions
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Fundamentals of Pulsed and Direct Current Electrophoretic Infiltration Kinetics
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AFM Characterization of the Nanoparticles Arrangement by Electrophoretic Deposition
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High Voltage Electrophoretic Deposition of Aligned Nanoforests for Scalable Nanomanufacturing of Electrochemical Energy Storage Devices
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Thin Films of Europium (III) Doped-TiO₂ Prepared by Electrophoretic Deposition from Nanoparticulate Sols
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 507Direct Numerical Simulations of Electrophoretic...

Direct Numerical Simulations of Electrophoretic Deposition of Charged Colloidal Suspensions

Abstract:

Motivated by applications in the field of nanomanufacturing, we perform large-scale numerical simulations of the electrophoretic deposition of suspensions of charged colloids in an electrolyte. A simulation method is developed to model the full deposition process that captures linear electrophoresis, dipolar interactions, van-der-Waals forces, steric interactions, Brownian motion, as well as electric and hydrodynamic interactions with the electrodes. Using a fast algorithm, suspensions of up to 5,000 particles are simulated, and results are reported for the final deposit microstructure as a function of field strength. The simulation results demonstrate that regular crystalline colloidal assemblies are obtained at low field strengths and volume fractions, while more random structures with frequent defects are formed in stronger fields and at higher volume fractions, in agreement with recent deposition experiments.

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Periodical:

Key Engineering Materials (Volume 507)

Pages:

47-51

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.507.47

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Online since:

March 2012

Authors:

Jae Sung Park, David Saintillan

Keywords:

Colloidal Suspensions, Direct Numerical Simulations, Electrophoretic Deposition (EPD), Stokesian Dynamics

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