Polishing of CVD Diamond Wafers and Films

Hai Bo Feng; Yi Qing Chen; Liang Chi Zhang

doi:10.4028/www.scientific.net/KEM.531-532.373

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Polishing of CVD Diamond Wafers and Films
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 531-532Polishing of CVD Diamond Wafers and Films

Polishing of CVD Diamond Wafers and Films

Abstract:

This paper investigates the applicability of the dynamic friction polishing (DFP) technique to process the chemical vapour deposition (CVD) diamond surfaces. Two types of CVD diamond specimens were studied. A stepwise polishing process was introduced to minimise the cracking in CVD thin films. The investigation focused on the polished surface quality in relation to the polishing conditions and material remove rates. It was found that by selecting proper polishing parameters, surfaces of quality finish with a roughness of less than 70 nm Ra could be obtained in 15 minutes when the specimens were CVD diamond wafers with an initial roughness of 17 μm. The polishing time could be reduced to only 2.5 minutes in the case of diamond thin film specimens of initial roughness of 1.6 μm.

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Periodical:

Key Engineering Materials (Volumes 531-532)

Pages:

373-376

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.531-532.373

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Online since:

December 2012

Authors:

Hai Bo Feng, Yi Qing Chen, Liang Chi Zhang

Keywords:

CVD Diamond Film, CVD Diamond Wafer, Dynamic Friction Polishing, Material Removal Rate (MRR), Surface Quality

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