Silicon Thermal Flow Sensor Based on Ceramic Substrate

Abstract:

A silicon thermal flow-sensor system based on ceramic substrate is described in this paper. The sensor chip is mounted on a ceramic substrate with a metal heat sink. The simulation by ANSYS software and the experiment are done for determining suitable package size. The results from the ANSYS simulation and the standard flow test in the flow tunnel show that when the radius of the ceramic is 10mm and the heat conduction is 35Wm^-1K^-1, the performance of the sensor is much better. The heat sink will make the flow-sensor more stable. The wind speed up to 35m/s and the precision of 0.5m/s are acquired in this experiment.

• Periodical: Key Engineering Materials (Volumes 609-610)
• Pages: 1060-1065
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.609-610.1060
• Online since: April 2014
• Authors: Sheng Qi Chen*, Lin Zhou, Ming Qin
• Keywords: ANSYS, Flow-Sensor, MEMS Packaging

References

[1] S. Haasl and G. Stemme, 2008. Flow sensors, in Comprehensive Microsystems, Y. Gianchandani, O. Tabata, and H. Zappe, Eds. Oxford, U.K.: Elsevier, p.209–272.

DOI: 10.1016/b978-044452190-3.00054-9

[2] C. G. J. Schabmueller, 2004, Flow sensors, in MEMS Mechanical Sensors. P. Beeby, G. Ensel, M. Kraft, and N. White, Eds. Norwood, MA: Artech House, p.213–256.

[3] Matsuyama, T. , Yoshikawa, K. , Yamazaki, Y. , Shikida, M. , Matsushima, M., Kawabe, T. Integration of catheter flow sensor onto tracheal intubation tube system, 2013 IEEE 26th International Conference on MEMS. pp.1037-1040.

DOI: 10.1109/memsys.2013.6474426

[4] Gould, D. , Sturm, H. , Lang, W. Thermoelectric Flow Sensor Integrated Into an Inductively Powered Wireless System, Sensors Journal, IEEE Volume: 12 , Issue: 6 , 2012 , Page(s): 1891 - 1892 [doi: 10. 1109/JSEN. 2011. 2179934].

DOI: 10.1109/jsen.2011.2179934

[5] Guang-Ping Shen, Ming Qin, Qing-An Huang, Hua Zhang, Jian Wu, 2008. Flip-chip on board packaging of a thermal wind sensor, pp.28-31[doi: 0. 1109/ICEPT. 2008. 4606948].

DOI: 10.1109/icept.2008.4606948

[6] Matova, S.P., Makinwa, K.A.A., Huijsing, J.H., Compensation of packaging asymmetry in a 2-D wind sensor, 2002. Proceedings of IEEE, p.1256~1259 [doi: 10. 1109/ICSENS. 2002. 1037296].

DOI: 10.1109/icsens.2002.1037296

[7] Ziqiang Dong, Ming Qin, Jingjing Chen, Yukun Qin, Qing-An Huang, 2011, Wafer level packaging based on AU-AU bonding for a CMOS compatible thermal wind sensor, 2011 16th International, pp.986-989. [doi: 10. 1109/TRANSDUCERS. 2011. 5969137].

DOI: 10.1109/transducers.2011.5969137

[8] Woo-Chang Choi, Hyun-Jin Choi Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS Devices, pp.1442-1448 Volume: 2, Issue: 9, Sept. (2012).

[9] Bangtao Chen, Sekhar, V.N. , Cheng Jin, Ying Ying Lim , Toh, J.S., Fernando, S. Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Sharma, Volume: 3 , Issue: 9, On Page(s): 1443-1452, Oct. 2013[doi: 10. 1109/TCPMT. 2013. 2263932].

DOI: 10.1109/tcpmt.2013.2263932

[10] Shweta, P., Anburajan, M. Finite element analysis of the skull implant using ansys software , Electronics Computer Technology (ICECT), 2011 3rd International Conference on, pp.420-425, [doi: 10. 1109/ICECTECH. 2011. 5941784].

DOI: 10.1109/icectech.2011.5941784

[11] Weinläder, A., Wu, W., Tenbohlen, S., Wang, Z. Prediction of the oil flow distribution in oil-immersed transformer windings by network modelling and computational fluid dynamics Electric Power Applications, Volume: 6, Issue: 2, 2012, pp.82-90.

DOI: 10.1049/iet-epa.2011.0122

[12] Chikina, I, Shikin, V, Varlamov, A A, 2012, Physical review. E, Statistical, nonlinear, and soft matter physics, ISSN 1539-3755, 86(1) pp.26-28.

[13] Nordin, N.F. Application of Seebeck Effect Imaging on failure analysis of via defect, 2012(IPFA), IEEE conference, p.1 – 4 , [doi: 10. 1109/IPFA. 2012. 6306316].