Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Dong Rui Wang; Mei Liu

doi:10.4028/www.scientific.net/KEM.609-610.1153

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Finite Element Analysis on Thermosonic Ball...

Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Abstract:

The wire bonding process in the package of MEMS accelerometer is analyzed by the finite element software ANSYS/LS-DYNA. Impact on the bonding strength of the ultrasonic amplitude, ultrasonic frequency and the friction between wire bond and bond pad are studied. The strength of wire bond is evaluated through the bond pull test experiment. The test result shows that the analysis on the wire bonding is helpful for improving the quality of wire bonding.

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

1153-1158

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.1153

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Online since:

April 2014

Authors:

Dong Rui Wang*, Mei Liu

Keywords:

Finite Element Method (FEM), MEMS Accelerometer, Wire Bonding

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* - Corresponding Author

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