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HomeKey Engineering MaterialsKey Engineering Materials Vols. 645-646Research on the Preparation of Nanoporous Copper...

Research on the Preparation of Nanoporous Copper Using Taguchi Method

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Abstract:

In this work, the influences of process parameters including electroplating time, annealing temperature, etchant concentration and dealloying time on the microstructures of nanoporous copper (NPC) were quantitatively evaluated in terms of pore size. Taguchi method was utilized to reduce the number of experiments required for the evaluation. The effect of each parameter variable on the characterization length scale of NPC was quantified and discussed. It was found that the annealing temperature was the most dominant factor influencing the microstructure of NPC and the dealloying time, electroplating time and etchant concentration contributed sequentially weakly to that of NPC.

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Micro-Nano Technology XVI

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Periodical:

Key Engineering Materials (Volumes 645-646)

Pages:

238-245

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.645-646.238

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Online since:

May 2015

Authors:

Ke Cheng Li, Xiao Gang Liu, Yong Chen, Ming Xiang Chen*

Keywords:

Nanoporous Copper, Pore Size, Preparation Process, Process Parameters, Taguchi Method

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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