Optimization of Microfluidic Chip Bonding Technology Based on Polydimethylsiloxane

Article Preview

Abstract:

This paper introduce a new polydimethylsiloxan (PDMS) microfluidic chip bonding technology. By studying the influence of prepolymer with different curing agents, curing temperatures and curing time to the PDMS-PDMS chip bonding strength,we get the optimal bonding parameters. The experiment results show that when the cover plate of PDMS with ratio 15:1 bond with the substrate whose ratio is 10:1,the largest strength can be reached. The research which was applied to the packing of microfluidic analysis chip has achieved good results.

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 645-646)

Pages:

741-745

Citation:

Online since:

May 2015

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] K. Choonee, R.R.A. Syms, M.M. Ahmad, H. Zou, Post processing of microstructures by PDMS spray deposition, Sensor actuat a-phys. 155(2009) 253-262.

DOI: 10.1016/j.sna.2009.08.029

Google Scholar

[2] Hsih Yin Tan, Weng Keong Loke, Nam-Trung Nguyen, A reliable method for bonding polydimethylsiloxane(PDMS) to polymethylmethylmethacrylate(PMMA) and its application in micropumps, Sensor actuat b-chem. 151(2010) 133-139.

DOI: 10.1016/j.snb.2010.09.035

Google Scholar

[3] Bjorn Samel, M Kamruzzaman Chowdhury, Goran Stemme, The fabrication of full-wafer adhesive bonding using a poly(dimethylsiloxane)catalyst, J micromech microeng. 17(2007) 1710-1714.

DOI: 10.1088/0960-1317/17/8/038

Google Scholar

[4] Anthony T. Design of a Microfluidic Chip for Three Dimensional Hydrodynamic Focusing in Cell Cytometry Applications[D]. Concordia University, (2011).

Google Scholar

[5] Mao X, Lin S C S, Dong C, et al. , Single-layer planar on-chip flow cytometer using microfluidic drifting based three-dimensional(3D)hydrodynamic focusing, Lab chip. 9(2009) 1583-1589.

DOI: 10.1039/b820138b

Google Scholar

[6] Cai D, Neyer A, Polydimethylsiloxane(PDMS)based optical interconnect with copper-clad FR4 substrates, Sensor actuat b-chem . 160(2011) 777-783.

DOI: 10.1016/j.snb.2011.08.062

Google Scholar

[7] Mark A Eddings, Micheal A Johnson, Bruce K Gale, Determining the optimal PDMS–PDMS bonding technique for microfluidic devices, J micromech microeng. 18(2008) 1-4.

DOI: 10.1088/0960-1317/18/6/067001

Google Scholar

[8] Nea Yoon Lee, Bong Hyun Chung, Novel poly(dimethylsiloxane)bonding strategy via room temperature chemical gluing, J am chem soc. 25(2009) 3861-3866.

DOI: 10.1021/la802823e

Google Scholar

[9] Ye Meiying, Fang Qun, Yin Xuefeng , Fang Zhaolun, Studies On Bonding techniques f or Poly( dimethylsiloxane)Microf luidic Chips, Chem j Chinese u. 23(2002) 2243-2246.

Google Scholar