Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 86-87)

Main Theme:

Edited by:

S. Hampshire, M. Buggy and A. J. Carr

Pages:

361-368

DOI:

10.4028/www.scientific.net/KEM.86-87.361

Citation:

C.M. Flannery et al., "Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications", Key Engineering Materials, Vols. 86-87, pp. 361-368, 1993

Online since:

July 1993

Export:

Price:

$35.00

In order to see related information, you need to Login.