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HomeKey Engineering MaterialsKey Engineering Materials Vols. 86-87Acoustic Microscopy of Tape Automated Bonding...

Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications

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Engineered Materials

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Periodical:

Key Engineering Materials (Volumes 86-87)

Pages:

361-368

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.86-87.361

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Online since:

July 1993

Authors:

C.M. Flannery, D. Zhang, G.M. Crean, S.C. O'Mathuna

Keywords:

Acoustic Microscopy, Kapton, Tape Automated Bonding, UPILEX-S

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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