Influence of Shallow Pits and Device Design of 4H-SiC VDMOS Transistors on In-Line Defect Analysis by Photoluminescence and Differential Interference Contrast Mapping

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Abstract:

In this study, UV Photoluminescence (UVPL) and Differential Interference Contrast (DIC) mapping was applied for process control of a 1.2 kV 4H-SiC VDMOS fabrication process at different process stages in order to investigate the influence of shallow pits on the electrical behavior of the devices. In particular, it could be shown that UVPL and DIC mapping allows the correlation of shallow pits and the occurrence of darker regions in the UVPL images and distinguishing differently implanted regions at distinct process stages. By comparing the darker regions of the UVPL scan with the electrical blocking characteristics of the associated devices a direct correlation between the occurrence of shallow pits and the reduction of the blocking capability of the devices could be observed.

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Materials Science Forum (Volume 1004)

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299-305

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July 2020

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© 2020 Trans Tech Publications Ltd. All Rights Reserved

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[1] T. Kimoto and J. A. Cooper, Fundamentals of silicon carbide technology: Growth, characterization, devices and applications. Singapore, Piscataway, New Jersey: Wiley IEEE; IEEE Xplore, (2014).

Google Scholar

[2] C. Kudou et al., Influence of Epi-Layer Growth Pits on SiC Device Characteristics,, Mater. Sci. Forum, 821-823, (2015) 177–180.

DOI: 10.4028/www.scientific.net/msf.821-823.177

Google Scholar

[3] F. Stumpf et al., Detailed characterisation of focused ion beam induced lateral damage on silicon carbide samples by electrical scanning probe microscopy and transmission electron microscopy,, J. Appl. Phys.,123, (2018) 125104.

DOI: 10.1063/1.5022558

Google Scholar

[4] H. Schlichting, T. Sledziewski, A. Bauer, and T. Erlbacher, Design Considerations for Robust Manufacturing and High Yield of 1.2 kV 4H-SiC VDMOS Transistors,, Mater. Sci. Forum, 963, (2019) 763–767.

DOI: 10.4028/www.scientific.net/msf.963.763

Google Scholar

[5] J. Schoeck, H. Schlichting, B. Kallinger, T. Erlbacher, and M. Rommel, Influence of Triangular Defects on the Electrical Characteristics of 4H-SiC Devices,, Mater. Sci. Forum, 924, (2018) 164–167.

DOI: 10.4028/www.scientific.net/msf.924.164

Google Scholar