Research Progress on Preparation of SiC/Al for Electronic Packaging by Liquid Infiltration

Abstract:

High volume fraction SiC/Al composite material, with its excellent thermal properties and flexible preparation process, has been widely used in the field of electronic packaging. In the paprer, the development of SiC/Al materials for electronic packaging and their preparation methods are reviewed. The preparation processes for preparing SiC/Al by liquid infiltration are mainly introduced. The advantages and disadvantages of several important processes are analyzed. Finally, the development trend of SiC/Al for electronic packaging prepared by liquid infiltration is prospected.

• Periodical: Materials Science Forum (Volume 1035)
• Pages: 906-917
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1035.906
• Online since: June 2021
• Authors: Meng Qin Chen*, Yue Long Bai, Zhi Feng Zhang
• Keywords: Liquid Infiltration, Preform, SiC/Al Composites, Thermal Performance

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