For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Preface
SmartSiC™ Substrates: A Boon to Drain Metallization Process
p.1
Surface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich Approach
p.7
HYPREZ Wafering Solutions: A Novel Approach of SiC Wafering Solution
p.13
Poly-SiC Characterization and Properties for SmartSiC™
p.21
Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization
p.27
A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer
p.35
High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils
p.43
Dicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal Masks
p.51

Preface

Article Preview

Abstract:

By email View Pdf
You might also be interested in these eBooks
Wafers and Substrates View Preview

Info:

Periodical:

Materials Science Forum (Volume 1124)

Online since:

August 2024

Сopyright:

© 2024 Trans Tech Publications Ltd. All Rights Reserved

Share:

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.