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Fabrication and Bonding Properties of Joints Formed by Transient Liquid Phase Diffusion Bonding Using Electroplated Films

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Abstract:

This study investigates the bonding properties of transient liquid phase diffusion bonding using Cu/Sn electroplated films. A Cu substrate was electroplated with Cu and Sn films, followed by TLP bonding with a Ni substrate at 280°C under air atmospheric conditions without bonding pressure. Bonding times of 1, 3, and 30 min were employed to evaluate the effect of bonding duration on interfacial microstructure and shear strength. Cross-sectional microstructural analysis using EPMA revealed the formation of a Cu–Ni–Sn reaction layer at the bonded interface, with the thickness of this layer increasing as bonding time increased. Voids were observed at all bonding times, particularly at 30 min, where extensive void formation led to incomplete bonding. Shear test showed that shorter bonding times yielded higher average strengths, while longer bonding times resulted in a reduction due to void-induced degradation. Fracture surface observations confirmed that failure occurred within both the Sn and reaction layer, regardless of bonding time.

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Periodical:

Materials Science Forum (Volume 1174)

Pages:

107-112

DOI:

https://doi.org/10.4028/p-QLxF7x

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Online since:

January 2026

Authors:

Tatsuya Kobayashi, Shunsuke Totsuka*, Ikuo Shohji

Keywords:

Bonding Strength, Electroplating, Intermetallic Compound, Transient Liquid Phase Diffusion Bonding

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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