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Comparison of Pd-42Cu-10Ni and Pd-30Cu-29.5Ag-0.5Zn as Probe Material in Interfacial Reaction with Sn

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Abstract:

A test probe is used for continuity test of semiconductor packages with solder balls. The probe material is often damaged due to solder adhesion on it by repeated test. The Pd-42Cu-10Ni (mass%) alloy has been developed as a substitute material for the conventional Pd-30Cu-29.5Ag-0.5Zn (mass%) alloy. The interfacial reaction between Pd-42Cu-10Ni and Sn by aging at 150°C was investigated in this study. Moreover, the obtained data was compared to those of the conventional alloy. As a result, it was confirmed that granular (Cu,Ni)6Sn5 forms at the interface between the reaction layer and Sn, and the reaction layer consists of stacked layers of the PdSn4+PdSn3 layer and the (Cu,Ni)6Sn5+Cu3Sn+PdSn layer. The reaction layer mainly grew toward the Sn side from the original interface. Furthermore, the thickness of the reaction layer grown by aging was suppressed to approximately one-fourth compared with the conventional alloy.

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Periodical:

Materials Science Forum (Volume 1175)

Pages:

117-122

DOI:

https://doi.org/10.4028/p-NJz57E

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Online since:

January 2026

Authors:

Rin Hashizume*, Tatsuya Kobayashi, Ikuo Shohji, Tomohisa Hoshino, Kenichi Sato, Shunsuke Kobayashi, Naohito Odani

Keywords:

Aging Treatment, Pd-30Cu-29.5Ag-0.5Zn, Pd-42Cu-10Ni, Reaction Layer, Sn

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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