Recrystallization and Grain Growth

Volumes 467-470

doi: 10.4028/www.scientific.net/MSF.467-470

Paper Title Page

Authors: Svetlana Malysheva, Gennady A. Salishchev, S.Yu. Mironov, Sergei Ya. Betsofen

Abstract: The paper considers the structure evolution during annealing of submicrocrystalline (SMC) titanium with a mean grain size of 0.2 µm,...

1289
Authors: Joke De Messemaeker, Bert Verlinden, Jan Van Humbeeck

Abstract: IF steel processed by equal channel angular pressing to an equivalent strain of 9.2 via route BA was annealed for different times at 500°C...

1295
Authors: Jaroslaw Mizera, Małgorzata Lewandowska, Bogusława Adamczyk-Cieślak, Krzysztof Jan Kurzydlowski

Abstract: Equal channel angular extrusion (ECAE) was used to obtain ultrafine grain structures in two aluminium- lithium alloys. The specimens were...

1301
Authors: R. Nicula, M. Stir, E. Burkel

Abstract: The crystallization and coarsening of pure and metal-doped (M: Ag, Fe, Co) TiO2 amorphous specimens were studied during in-situ synchrotron...

1307
Authors: Jong Kweon Kim, Jun Hyuk Seo, Yong Bum Park

Abstract: In the present work, a nanocrystalline Invar alloy (Fe-36wt%Ni) foil was fabricated by using a continuous electroforming method. This...

1313
Authors: Stijn Poortmans, Bert Verlinden

Abstract: Samples of a hot-rolled AA1050 Aluminium alloy have been deformed by ECAE for 4 and 8 passes following route C. The structural stability of...

1319
Authors: Satyam Suwas, André Eberhardt, László S. Tóth, Jean-Jacques Fundenberger, Thierry Grosdidier

Abstract: The amount of stored energy of cold work for the processing routes A and Bc of Equal Channel Angular Extrusion (ECAE) process has been...

1325
Authors: Dong Nyung Lee, Hyo Jong Lee

Abstract: The properties of deposited metal films and interconnect structures at submicrometer scale are sensitive functions of microstructural...

1333
Authors: Matthias Militzer, P. Freundlich, D. Bizzotto

Abstract: Cu interconnects are essential in advanced integrated circuits to minimize the RC delay. In manufacturing these devices, Cu is deposited...

1339
Authors: A.A. Rasmussen, Ali Gholinia, Patrick W. Trimby, Marcel A.J. Somers

Abstract: The influence of heat treatment on the microstructure and the microtexture of electrodeposited Ni and Ni-Co layers was investigated with...

1345

Showing 201 to 210 of 220 Paper Titles