The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film

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Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

3619-3622

DOI:

10.4028/www.scientific.net/MSF.475-479.3619

Citation:

H.W. Choi et al., "The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film", Materials Science Forum, Vols. 475-479, pp. 3619-3622, 2005

Online since:

January 2005

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$35.00

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