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A New Method for Measuring Residual Stress Relaxation during Nanoindentation

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Abstract:

The work of nanoindentation approach is developed and applied for measure of residual stress relaxation during indenter penetrates in thin films. The residual stress at given penetration depth is measured from the different integral area which under load-depth curve of different stress state. This method can measure residual stress relaxation without the need for estimating yield strength, strain hardening index and hardness.

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Periodical:

Materials Science Forum (Volumes 490-491)

Pages:

213-217

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.490-491.213

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Online since:

July 2005

Authors:

Fei Wang, Ke Wei Xu

Keywords:

Nanoindentation, Residual Stress, Thin Film

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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