Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE

Abstract:

Article Preview

A submicron-grained (SMG) microstructure, with an average grain size of ~0.4 µm was produced by equal channel angular extrusion (ECAE). The SMG microstructure was composed of large dynamic recrystallized grains within a matrix of deformed elongated cells. Samples were annealed for various times at 473 K and then examined using transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD). The results specify that a large recovery takes place during the first annealing times. Moreover, MET investigations show nucleation of grains which orientations are found in the recrystallized texture. The EBSD measurements established that, after 7min30s at 473 K, the microstructure is equiaxed and stable with an average grain size of about 2 µm.

Info:

Periodical:

Materials Science Forum (Volumes 495-497)

Edited by:

Paul Van Houtte and Leo Kestens

Pages:

845-850

DOI:

10.4028/www.scientific.net/MSF.495-497.845

Citation:

A. L. Etter et al., "Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE ", Materials Science Forum, Vols. 495-497, pp. 845-850, 2005

Online since:

September 2005

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.