Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
A submicron-grained (SMG) microstructure, with an average grain size of ~0.4 µm was produced by equal channel angular extrusion (ECAE). The SMG microstructure was composed of large dynamic recrystallized grains within a matrix of deformed elongated cells. Samples were annealed for various times at 473 K and then examined using transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD). The results specify that a large recovery takes place during the first annealing times. Moreover, MET investigations show nucleation of grains which orientations are found in the recrystallized texture. The EBSD measurements established that, after 7min30s at 473 K, the microstructure is equiaxed and stable with an average grain size of about 2 µm.
Paul Van Houtte and Leo Kestens
A. L. Etter et al., "Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE ", Materials Science Forum, Vols. 495-497, pp. 845-850, 2005