Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE

Anne Laure Etter; Denis Solas; Thierry Baudin; Richard Penelle

doi:10.4028/www.scientific.net/MSF.495-497.845

Paper Titles

Texture Gradient in ECAP Silver Measured by Synchrotron Radiation
p.821

Formation of Inhomogeneous Texture and Structure in Metal Materials under Equal-Channel Angular Pressing
p.827

Heterogeneity of Deformation in Pure Ni Single Crystal of Cube Orientation Deformed by Equal Channel Angular Extrusion
p.833

Experiments and Modelling of ECAE Textures of f.c.c. Polycrystals
p.839

Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
p.845

Texture of Al-Cu Alloys Deformed by ECAP
p.851

Equal Channel Extrusion Heterogeneities in Recrystallized Copper
p.857

Analysis of Textures of Wires Drawn in Pressure and Roller Dies with ODF
p.865

Variance of the Grain Boundary Character Distribution
p.871

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Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE

Abstract:

A submicron-grained (SMG) microstructure, with an average grain size of ~0.4 µm was produced by equal channel angular extrusion (ECAE). The SMG microstructure was composed of large dynamic recrystallized grains within a matrix of deformed elongated cells. Samples were annealed for various times at 473 K and then examined using transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD). The results specify that a large recovery takes place during the first annealing times. Moreover, MET investigations show nucleation of grains which orientations are found in the recrystallized texture. The EBSD measurements established that, after 7min30s at 473 K, the microstructure is equiaxed and stable with an average grain size of about 2 µm.