On Topographic Properties of Semiconductor Surfaces and Thin Film Systems

Abstract:

The microroughness of the semiconductor/oxide interface substantially influence properties of the whole structure. In our work Si/SiO2/SiOx structures were prepared by using low temperature nitric acid oxidation technique and by the electron gun technique and then the whole structure was passivated by the HCN technique. In the present study we investigate the surface morphology evolution during the creation of the SiO2/SiOx double-layer and after the passivation steps. Surface roughness properties are studied by the fractal geometry methods. The complexity of analysed surface is sensitive to the oxidation and passivation steps and the proposed fractal complexity measure values enable quantifying of the fine surface changes.

• Periodical: Materials Science Forum (Volume 609)
• Pages: 275-279
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.609.275
• Online since: January 2009
• Authors: Stanislav Jurečka, Hikaru Kobayashi, Masao Takahashi, Róbert Brunner, Mohammad Madani, Emil Pinčík
• Keywords: Atomic Force Microscope (AFM), Fractal, Multifractal Analysis, Semiconductor, Surface Roughness (SR), Thin Film

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