In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins

Abstract:

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This paper reviews our recent studies on the effect of twin boundary (TB) on the deformation behavior in Cu with nanoscale growth twins. In situ straining transmission electron microscopy investigations on TB migration, TBs and twin ends acting as dislocation emission sources, and the interactions between dislocations and TBs are highlighted. Results provide some useful understanding of why Cu with nanoscale twins leads to a combination of ultrahigh strength and high ductility.

Info:

Periodical:

Materials Science Forum (Volumes 633-634)

Edited by:

Yonghao Zhao and Xiaozhou Liao

Pages:

63-72

DOI:

10.4028/www.scientific.net/MSF.633-634.63

Citation:

Y. B. Wang and M.L. Sui, "In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins", Materials Science Forum, Vols. 633-634, pp. 63-72, 2010

Online since:

November 2009

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Price:

$35.00

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