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Defect and Damage Evolution Quantification in Dynamically-Deformed Metals Using Orientation-Imaging Microscopy

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Abstract:

Orientation-imaging microscopy offers unique capabilities to quantify the defects and damage evolution occurring in metals following dynamic and shock loading. Examples of the quantification of the types of deformation twins activated, volume fraction of twinning, and damage evolution as a function of shock loading in Ta are presented. Electron back-scatter diffraction (EBSD) examination of the damage evolution in sweeping-detonation-wave shock loading to study spallation in Cu is also presented.

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Periodical:

Materials Science Forum (Volumes 654-656)

Pages:

2297-2302

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.654-656.2297

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Online since:

June 2010

Authors:

George (Rusty) T. Gray III, Veronica Livescu, Ellen K. Cerreta

Keywords:

Cu, Dynamic Damage Evolution, Electron Backscatter Diffraction (EBSD), Spallation, Ta

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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