Stress Analysis by Kossel Microdiffraction on a Nickel-Based Single Crystal Superalloy during an In Situ Tensile Test – Comparison with Classical X-Ray Diffraction
A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses. An area of about one cubic micrometer can be analysed using the microscope probe, which enables to study different kinds of elements such as a grain boundary, a crack, a microelectronic component, etc. The diffraction pattern is recorded by a high resolution Charge-Coupled Device (CCD) camera. The crystallographic orientation, the lattice parameters and the elastic strain tensor of the probed area are deduced from the pattern indexation using a homemade software. The purpose of this paper is to report some results achieved up to now to estimate the reliability of the Kossel microdiffraction technique.
Paolo Scardi and Cristy L. Azanza Ricardo
D. Bouscaud et al., "Stress Analysis by Kossel Microdiffraction on a Nickel-Based Single Crystal Superalloy during an In Situ Tensile Test – Comparison with Classical X-Ray Diffraction", Materials Science Forum, Vol. 681, pp. 1-6, 2011