Stress Analysis by Kossel Microdiffraction on a Nickel-Based Single Crystal Superalloy during an In Situ Tensile Test – Comparison with Classical X-Ray Diffraction

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A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses. An area of about one cubic micrometer can be analysed using the microscope probe, which enables to study different kinds of elements such as a grain boundary, a crack, a microelectronic component, etc. The diffraction pattern is recorded by a high resolution Charge-Coupled Device (CCD) camera. The crystallographic orientation, the lattice parameters and the elastic strain tensor of the probed area are deduced from the pattern indexation using a homemade software. The purpose of this paper is to report some results achieved up to now to estimate the reliability of the Kossel microdiffraction technique.

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Edited by:

Paolo Scardi and Cristy L. Azanza Ricardo

Pages:

1-6

DOI:

10.4028/www.scientific.net/MSF.681.1

Citation:

D. Bouscaud et al., "Stress Analysis by Kossel Microdiffraction on a Nickel-Based Single Crystal Superalloy during an In Situ Tensile Test – Comparison with Classical X-Ray Diffraction", Materials Science Forum, Vol. 681, pp. 1-6, 2011

Online since:

March 2011

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$35.00

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