Design of High Thermal Conductivity Particle Filled Polymer Using Effective Thermal Conductivity Models

B. Garnier; F. Danes

doi:10.4028/www.scientific.net/MSF.714.21

Paper Titles

Influence of Interphase Properties on the Macroscopic Response of Single- and Double-Walled CNT/Epoxy Nanocomposites: A Numerical Study
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Micromechanical Modeling of the Effective Viscoelastic Response of Polyamide-6-Based Nanocomposites Reinforced with Modified and Unmodified Montmorillonite Clay
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Design of High Thermal Conductivity Particle Filled Polymer Using Effective Thermal Conductivity Models
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Multiscale Finite Element Modelling of Gallery Failure in Epoxy-Clay Nanocomposites
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Multiscale Modeling Electrospun Nanofiber Structures
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Photo-Induced Optical Anisotropy and Morphological Study in Azobenzene Containing Block Copolymers
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Determination of Phase Content in Multiphase Polymers by Solid-State NMR Techniques
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Effects of Orientation on the Segmental Dynamics of Natural Rubber
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HomeMaterials Science ForumMaterials Science Forum Vol. 714Design of High Thermal Conductivity Particle...

Design of High Thermal Conductivity Particle Filled Polymer Using Effective Thermal Conductivity Models

Abstract:

The context of this work is the enhancement of the thermal conductivity of polymer by adding conductive particles. It will be shown how we can use effective thermal conductivity models to investigate effect of various factors such as the volume fraction of filler, matrix thermal conductivity, thermal contact resistance, and inner diameter for hollow particles. Analytical models for lower bounds and finite element models will be discussed. It is shown that one can get some insights from effective thermal conductivity models for the tailoring of conductive composite, therefore reducing the amount of experimental work.

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Periodical:

Materials Science Forum (Volume 714)

Pages:

21-24

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.714.21

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Cite this paper

Online since:

March 2012

Authors:

B. Garnier, F. Danes

Keywords:

Composite, Computer Simulation, Effective Thermal Conductivity, Filled Polymers, Heterogeneous Material

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