Materials Science Forum Vols. 717-720

Abstract: We investigated with ab initio calculations the 3C-, 6H-, 4H- and 2H-SiC polytypes. We discuss the geometry and the energetics of bulk and surface relaxed structures ((0001) Si face and the (000-1) C face surfaces). The polytype stability is discussed regarding the bulk and surface effects.

Abstract: Crystallinity of 4H-SiC bulk crystal obtained by solution growth technique was characterized mainly by KOH etching of the off-ground and serially ground specimen. Marked reduction of basal plane dislocation, threading edge and screw dislocations during the growth of on-axis crystal was confirmed. Cross-sectional TEM observation revealed the rapid reduction behavior of threading dislocations microscopically. AFM observation of as-grown morphology showed that screw dislocation dipoles is related to the reduction of threading screw dislocations and single domain formation, which is essential for establishing the high crystallinity.

Abstract: In an effort to grow single crystal SiC fibers for seed crystals the following two growth methods have been coupled in this work: traveling solvent and laser heated floating zone to create the solvent-laser heated floating zone (Solvent-LHFZ) crystal growth method. This paper discusses the results of these initial experiments, which includes, source material, laser heating, and analysis of the first ever SiC crystals (confirmed by synchrotron white beam x-ray topography)

Abstract: We introduce a method to grow 4H-SiC single polytype stably by controlling the surface morphology. The polytype transition on on-axis 4H-SiC C-face was investigated from a viewpoint of surface morphology of grown layers. At the area where several hillock-like structures grew adjacently, the polytype transition from 4H-SiC to 6H-SiC or 15R-SiC often occurred. Therefore, we tried a modified seeded method to suppress the formation of hillock-like structures. As a result, the hillock-like structure on the grown layer was dramatically reduced. Moreover, the ratio of 4H-SiC polytype to the whole grown surface was increased to be almost 100%.

Abstract: Void formation in 4H-SiC crystals grown from solution has been investigated by secondary ion mass spectrometry and Raman scattering. It becomes clear that ambient Ar gas is filled in voids and the solvent (Si) partially remains. The result indicates that Ar dissolved in the solvent vaporizes and forms bubbles. The trapped bubbles at the crystal growth front are considered to be incorporated in the growing crystal as voids. We also have developed following methods for suppression of the void formation; (1) dipping seed crystals so that the growth front faces upward, (2) growth under He atmosphere, and (3) the high temperature treatment of the solvent before crystal growth.

Abstract: We have grown high-quality long cylindrical (12 mm thick) 4H-SiC bulk crystals by the meniscus formation technique, which was first applied for the solution growth of bulk SiC. It enabled long-term growth by suppressing parasitic reactions such as polycrystal precipitation around the seed crystal. In addition, we could control the growth angle from −22° to 61° by adjusting the meniscus height. The thickness of the grown cylindrical crystals was 12 mm, which is the largest reported until now, and corresponded to a growth rate of 0.6 mm/h. Smooth morphology growth was maintained on the (000-1) C-face. In cross-sectional transmission optical microscopy images, few solvent inclusions and voids were observed. XRD measurements revealed that the FWHM values of the grown crystals were almost the same as those of the seed crystal.

Abstract: The growth of thick 2H-SiC layers in Si-Li solution under a continuous CH₄ flow at atmospheric pressure was investigated. The thickness of the 2H-SiC layer increased linearly with the growth period, reaching as thick as 270-μm with a growth period of 7 hr. The Li concentration in the layers was as low as 1.0 × 10¹⁸ atoms/cm³, which was less than one-hundredth that observed in a previous study.

Abstract: Besides the seeded sublimation process, which is the current industrial crystal growth process for silicon carbide (SiC), solution growth appears as a possible method for high quality bulk crystals. For a further development of the latter technique, a robust numerical model has been implemented with the aim to give quantitative outcomes in addition to qualitative information. Growth rates have been calculated for three different temperature ranges (1700, 1800 and 1900°C) in pure silicon. The computed values were found to be in good agreement with the experimental ones.

Abstract: Initial results are presented for SiC-epitaxial growths employing a novel 6x150-mm/10x100-mm Warm-Wall Planetary Vapor-Phase Epitaxial (VPE) Reactor. The increased areal throughput offered by this reactor and 150-mm diameter wafers, is intended to reduce the cost per unit area for SiC epitaxial layers, increasing the market penetration of already successful commercial SiC Schottky and MOSFET devices [1]. Growth rates of 20 micron/hr and short <2 hr fixed-cycle times (including rapid heat-up and cool-down ramps), while maintaining desirable epitaxial layer quality were achieved. No significant change in 150 mm diameter wafer shape is observed upon epitaxial growth consistent with good-quality, low-stress substrates and low (<5°C) cross-wafer epitaxial reactor temperature variation. Specular epitaxial layer morphology was obtained, with morphological defect densities consistent with projected 5x5 mm die yields as high as 80% and surface roughness, Ra, of 0.3 nm. Intrawafer thickness uniformity is good, averaging only 1.6% and within a run wafer-to-wafer thickness variation is 2.7%. N-type background doping densities less that 1E14 cm-3 have been measured by CV. Doping uniformity and wafer-to-wafer variation currently average ~12% requiring further improvement. The first 100 m thick 150-mm diameter epitaxial growths are reported.

Abstract: Thick and low-doped epilayers with a low Z_1/2 center concentration were grown on 8^o off-cut 4H-SiC(0001)Si-face substrate. Two post-growth processes, namely, the C⁺-implantation/annealing process or the thermal oxidation/Ar annealing process, were applied to the thick epilayers. The dependence of the Z_1/2 center concentration and the carrier lifetime on process conditions was investigated. Under proper conditions, both processes could eliminate the Z_1/2 center to a depth of 100 μm or more, and considerably improved the carrier lifetime while maintaining the surface roughness comparable to that of the as-grown sample. The effect of the post-growth processes applied on C-face is also presented.