Hydrogen Effects in ECR-Etching of 3C-SiC(100) Mesa Structures

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Abstract:

An anisotropic etching process for mesa structures using fluorinated plasma with hydrogen addition was developed in an electon cyclotron resonance setup. The evolution of the mesa morphology was studied in dependence on the gas composition, the applied bias and the pressure. The achieved side wall slope approached 90° with a negligible trenching. The aspect ratios of the fabricated structure in the developed residue free ECR plasma etching process were between 5 and 20.

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Materials Science Forum (Volumes 778-780)

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730-733

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February 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] M. Hofer, Th. Stauden, I.W. Rangelow, J. Pezoldt, Mater. Sci. Forum 645-648 (2010) 841-844.

DOI: 10.4028/www.scientific.net/msf.645-648.841

Google Scholar

[2] Y. Ikoma, T. Tada, K. Uchiyama, F. Watanabe, T. Motooka, Solid State Phenomena 78-79 (2001) 157-164.

DOI: 10.4028/www.scientific.net/ssp.78-79.157

Google Scholar

[3] M.E. Okhuysen, M.S. Mazzola, Y. -H. Lo, Mater. Sci. Forum, 338-342 (2000) 305-308.

Google Scholar

[4] Y. Fu, F. Yun, Y.T. Moon, J.Q. Xie, Ü. Özgir, S. Dogan, H. Morkoc, C.K. Inoki, T.S. Kuan, I. Zhou, D.J. Smith, Appl. Phys. Lett. 86 (2005) 043108/1-043108/3.

DOI: 10.1063/1.1849833

Google Scholar

[5] D. Zubia, S.H. Zaidi, S.R.J. Brueck, S.D. Hersee, Appl. Phys. Lett. 76 (2000) 858-860.

DOI: 10.1063/1.125608

Google Scholar

[6] R.M. Kemper, L. Hiller, T. Stauden, J. Pezoldt, K. Duschik, T. Niendorf, H.J. Maier, D. Meertens, K. Tillmann, D.J. As, J.K.N. Lindner, J. Cryst. Growth 378 (2013) 291-294.

DOI: 10.1016/j.jcrysgro.2012.10.011

Google Scholar

[7] G. McDaniel, J.W. Lee, E.S. Lambers, S.J. Pearton, P.H. Holloway, F. Ren, J.M. Grow, M. Bhaskaran, R.G. Wilson, J. Vac. Sci. Technol. A 15 (1997) 885-889.

Google Scholar

[8] J.J. Wang, E.S. Lambers, S.J. Pearton, M. Ostling, C. -M- Zetterling, J.M. Grow, F. Ren, R.J. Shul: Solid-State Electronics, 42 (1998) 2283-2288.

DOI: 10.1016/s0038-1101(98)00226-3

Google Scholar

[9] P. Yih, A.J. Steckl, J. Electrochem. Soc. 140 (1993) 1813-1824.

Google Scholar

[10] Th. Stauden, F. Niebelschütz, K. Tonisch, V. Cimalla, G. Ecke, Ch. Haupt, J. Pezoldt, Mater. Sci. Forum, 600-603 (2009) 651-654.

DOI: 10.4028/www.scientific.net/msf.600-603.651

Google Scholar

[11] Ch. Förster, V. Cimalla, M. Stubenrauch, C. Rockstuhl, K. Brueckner, M. Hein, J. Pezoldt, O. Ambacher, Mater. Sci. Forum 527-529 (2006) 1111-1114.

DOI: 10.4028/www.scientific.net/msf.527-529.1111

Google Scholar

[12] L. Hiller, Th. Stauden, R.M. Kemper, J.K.N. Lindner, D.J. As, J. Pezoldt, Mater. Sci. Forum 717-720 (2012) 901-904.

DOI: 10.4028/www.scientific.net/msf.717-720.901

Google Scholar

[13] F. Niebelschütz, Th. Stauden, K. Tonisch, J. Pezoldt, Mater. Sci. Forum 645-648 (2010) 849-852.

DOI: 10.4028/www.scientific.net/msf.645-648.849

Google Scholar

[14] Ch. Förster, V. Cimalla, R. Kosiba, G. Ecke, P. Weih, O. Ambacher, J. Pezoldt, Mater. Sci. Forum 457-460 (2004) 821-824.

DOI: 10.4028/www.scientific.net/msf.457-460.821

Google Scholar

[15] H. Dimigen, H. Lüthje, Philips Techn. Rev. 35 (1975) 199-208.

Google Scholar