I - V Characteristics in Surface-Activated Bonding (SAB) Based Si/SiC Junctions at Raised Ambient Temperatures

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Abstract:

The physical and electrical properties of p+-Si/n-4H-SiC and n+-Si/n-4H-SiC heterojunctions fabricated by using surface-activated bonding (SAB) were investigated by scanning electron microscopy (SEM), current-voltage (I-V) and breakdown characteristics measurements at raised ambient temperatures. The I-V characteristics for the reverse bias voltages of the two junctions were compared with the expectations based on Frenkel-Poole, and trap-assisted tunneling models. The results of calculations using the trap-assisted tunneling model were close to the measurements.

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Materials Science Forum (Volumes 778-780)

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718-721

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February 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] H. Morkoç, S. Strite, G. B. Gao, M. E. Lin, and B. Sverdlov, J. Appl. Phys. 76 (1994) 1363-1398.

Google Scholar

[2] http: /www. mitsubishielectric. com/news/2013/0509-a. html.

Google Scholar

[3] T. Hayashi, Y. Shimoida, H. Tanaka, S. Yamagami, S. Tanimoto, and M. Hoshi, Mater. Sci. Forum, 527–529 (2006) 1453-1456.

DOI: 10.4028/www.scientific.net/msf.527-529.1453

Google Scholar

[4] O. J. Guy, A. Pérez-Tomás, M. R. Jennings, M. Lodzinski, A. Castaing, P. A. Mawby, J. A. Covington, S. P. Wilks, R. Hammond, D. Commolly, S. Jones, J. Hopkins, T. Wilby, N. Rimmer, K. Baker, S. Conway, and S. Evans, Mat. Sci. Forum, 615-617 (2009).

DOI: 10.4028/www.scientific.net/msf.615-617.443

Google Scholar

[5] J. Liang, T. Miyazaki, M. Morimoto, S. Nishida, N. Watanabe, and N. Shigekawa, Applied Physics Express 6 (2013) 021801-1-021801-3.

DOI: 10.7567/apex.6.021801

Google Scholar

[6] N. Shigekawa, N. Watanabe, and E. Higurashi, Proc. 3rd int. IEEE Workshop on Low-Temperature Bonding for 3D Integration, (2012) pp.109-112.

DOI: 10.1109/ltb-3d.2012.6238065

Google Scholar

[7] H. Zhang, E. J. Miller, and E. T. Yu, J. Appl. Phys. 99 (2006) 023703-1-023703-6.

Google Scholar

[8] R. Mahapatra, A. K. Chakraborty, N. Poolamai, A. Horsfall, S. Chattopadhyay, N. G. Wright, K. S. Coleman, and C. P. Burrows, J. Vac. Sci. Technol. B 25, (2007) 217-223.

DOI: 10.1116/1.2433976

Google Scholar

[9] S. Qing-Wen, Z. Yu-Ming, Z. Yi-Men, L. Hong-Liang, C. Feng-Ping, and Z. Qing-Li, Chin. Phy. B (2009) 5474-5478.

DOI: 10.1088/1674-1056/18/12/057

Google Scholar

[10] L. Patrick, and W. J. Choyke, Phy. Rev. B (1970) 2255-2256.

Google Scholar