Anti-Reflective Porous Silicon Features by Substrate Conformal Imprint Lithography for Silicon Photovoltaic Applications

G.J. Blayney; C. Zaradzki; Y. Liu; M.A. Mohd-Azmi; Owen James Guy

doi:10.4028/www.scientific.net/MSF.806.109

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HomeMaterials Science ForumMaterials Science Forum Vol. 806Anti-Reflective Porous Silicon Features by...

Anti-Reflective Porous Silicon Features by Substrate Conformal Imprint Lithography for Silicon Photovoltaic Applications

Abstract:

Silicon photovoltaic cells require anti-reflection treatments in order to minimise optical losses and improve cell efficiencies. Commercially, the silicon surface is textured using a chemical etchant followed by the addition of an anti-reflective coating to further suppress reflectivity. We present a process using metal assisted etching to create porous silicon features capable of reducing reflectivity to less than 5%. A method for producing porous silicon using Substrate Conformal Imprint Lithography (SCIL) has been developed in order to pattern the nanoscale anti-reflective structures onto silicon wafers.

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Periodical:

Materials Science Forum (Volume 806)

Pages:

109-113

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.806.109

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Online since:

October 2014

Authors:

G.J. Blayney*, C. Zaradzki, Y. Liu, M.A. Mohd-Azmi, Owen James Guy

Keywords:

Metal Assisted Etching, Porous Silicon, Substrate Conformal Imprint Lithography

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