Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling

Abstract:

In the present study, Cobalt nanoparticles were synthesized and mixed with Sn-3.0Ag-0.5Cu solder (SAC305). The effect of 0.05 wt.%, 0.2 wt.%, 0.5 wt.% and 1.0 wt.% Co nanoparticles on the wettability, the shear strength as well as the growth of intermetallic compounds (IMCs) at composite solder/Cu interface during thermal cycling were investigated. Results show that Co nanoparticle addition can considerably improve wettability, increase the shear strength and suppress the growth of interfacial IMCs. The addition amount of Co nanoparticles have the consistent relation with the improvement extent of the wettability, shear strength and the growth rate of interfacial IMCs. Slight addition (0.05 wt.% and 0.2 wt.%) can significantly improve the properties of nanocomposite solder in all the three aspects. However, with excessive addition amount (0.5 wt.% and 1.0 wt.%) of Co nanoparticles, the improvement extent will decline. The Cross-section images of the interface of nanocomposite solder/Cu joint show that Co can form reinforcement particles in the solder and can act as the sacrificial element to substitute Cu to react with Sn. Excessive Co nanoparticles would form large amount of hard and brittle intermetallics which leads to decreasing shear strength of the composite solder.

• Periodical: Materials Science Forum (Volume 815)
• Pages: 97-102
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.815.97
• Online since: March 2015
• Authors: Yue Gu, Ying Liu, Xiu Chen Zhao, Shu Lai Wen, Hong Li, Yuan Wang
• Keywords: Cobalt Nanoparticles, Shear Strength, Sn-3.0Ag-0.5Cu, Thermal Cycling, Wettability

References

[1] Liu W, Lee N-C: JOM. 59(2007) 26-31.

[2] Ma H, Suhling JC : Journal of Materials Science. 44(2009) 1141-1158.

[3] El-Daly AA, Fawzy A, Mansour SF and Younis MJ: Journal of Materials Science: Materials in Electronics. 24(2013) 2976-2988.

[4] Wang M, Wang J, Feng H and Ke W: Materials Science and Engineering: A. 558(2012), 649-655.

[5] Shnawah DA-A, Said SBM, Sabri MFM, Badruddin IA, Hoe TG, Che FX, et al: Journal of Electronic Materials. 41(2012) 2073-(2082).

[6] Gain AK, Chan YC: Intermetallics. 29(2012) 48-55.

[7] Magagnin L, Sirtori V, Seregni S, Origo A, Cavallotti PL: Electrochimica Acta. 50(2005), 4621-4625.

DOI: 10.1016/j.electacta.2004.10.098

[8] Sun P, Andersson C, Wei X, Cheng Z, Shangguan D, Liu J: n Materials Science and Engineering: B. 135(2006) 134-140.

[9] Chan YH, Arafat MM, Haseeb ASMA: Soldering & Surface Mount Technology. 25(2013) 91-98.

[10] Hammad AE: Materials & Design. 52(2013) 663-670.

[11] Ma L, Tai F, Xu G, Guo F, Wang X: Journal of Electronic Materials. 40(2011 1416-1421.

[12] Pan H-C, Hsieh T-E: Journal of Electronic Materials. 40(2011) 330-339.

[13] Law CMT, Wu CML, Yu DQ, Wang L, Lai JKL: Journal of Electronic Materials. 35(2006) 89-93.

[14] DHARMA IGBB, SHUKOR MHA, ARIGA, #160, Tadashi: Sendai, JAPON: Japan Institute of Metals; (2009).

[15] Haseeb ASMA, Leng TS: Intermetallics. 19(2011) 707-712.

[16] Ma L, Xu G, Sun J, Guo F, Wang X: Journal of Materials Science. 46(2011) 4896-4905.

[17] Lu N, Yang D, Li L: Acta Materialia. 61(2013) 4581-4590.