Starting Point of Step-Bunching Defects on 4H-SiC Si-Face Substrates

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Abstract:

On 4H-SiC Si-face substrates after H2 etching, the defect with “line” feature parallel to a step as “bunched-step line” was observed. Using X-ray topography and KOH etching, we confirmed that the bunched-step line originated from basal plane dislocation (BPD). Use of the substrate with the lowest BPD density will be effective to reduce bunched-step line that would affect oxide layer reliability on an epitaxial layer. However, more detail investigation needs to classify the BPD that would become a starting point of bunched-step line.

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Materials Science Forum (Volumes 821-823)

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367-370

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June 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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