Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

Shijo Nagao; Naoki Fujisawa; Takuo Sugioka; Satoshi Ogawa; Teruhisa Fujibayashi; Takaaki Wada; Tohru Sugahara; Katsuaki Suganuma

doi:10.4028/www.scientific.net/MSF.821-823.923

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HomeMaterials Science ForumMaterials Science Forum Vols. 821-823Nanoscale Dynamic Mechanical Analysis on...

Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

Abstract:

Heat-resistance of novel mold compound made of silsesquioxane nanocomposite with silica fillers is demonstrated in a TO247 package of SiC SBD. The test specimens are exposed to thermal cycling between -50°C and 250°C, and the thermal damage of the mold are precisely evaluated by using nanoscale dynamical mechanical analysis based on nanoindentation technology. The results reveal that the excellent heat-resistance is brought by the miscibility between the thermosetting nanocomposite and silica fillers.

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Periodical:

Materials Science Forum (Volumes 821-823)

Pages:

923-926

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.821-823.923

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Online since:

June 2015

Authors:

Shijo Nagao*, Naoki Fujisawa, Takuo Sugioka, Satoshi Ogawa, Teruhisa Fujibayashi, Takaaki Wada, Tohru Sugahara, Katsuaki Suganuma

Keywords:

Dynamical Mechanical Analysis, Heat-Resistant Mold Compound, Nanoindentation, Silsesquioxane Nanocomposite

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