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HomeMaterials Science ForumMaterials Science Forum Vol. 848Preparation and Properties of SiC/Phenolic Resin...

Preparation and Properties of SiC/Phenolic Resin for the Heat of LED

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Abstract:

In order to solve the problem that low thermal conductivity of the plastics for the heat of LED, SiC/Phenolic resin for the heat of LED were fabricated combining powder metallurgy. The effects of particles diameters, content and adding nanoparticles on thermal conductivity of the fabricated composites were investigated, the mechanical properties were also characterized. The experimental results showed that the materials were obtained, and the insulation performance of the fabricated SiC/Phenolic resin was higher than the industry standard one, the thermal conductivity reached 4.1W/(m·k)^-1. And the bending strength of the fabricated composites was up to 68.11MPa. The problem of low thermal conductivity of the material is expected to be solved. In addition, it is meaningful for improving LED life.

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Periodical:

Materials Science Forum (Volume 848)

Pages:

454-459

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.848.454

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Online since:

March 2016

Authors:

Cong Wu, Kang Zhao, Yu Fei Tang, Ji Yuan Ma

Keywords:

Heat Dissipating Material, Phenolic Resin, Silicon Carbide, Thermal Conductivity

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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