Organic/Inorganic Hybrid Materials for Organic Electronic Application

Abstract:

Organic/inorganic stacks were deposited on flexible polycarbonate substrate using inductively coupled plasma chemical vapor deposition (ICP-PECVD) for permeation barrier application. The effects of deposition temperature, RF power, gas flow ratio, deposition pressure on film properties of surface roughness, water vapor transmission rate (WVRT) were investigated. Energy dispersive spectrum (EDS), atomic force microscopy (AFM) and transmission electron microscopy (TEM) were used to characterize the film characteristics of the stack layers. It was found that the surface roughness Ra was as low as is 0.25 nm. The WVRT values of the optimum barriers structures were 10^-2g/m² day (1 pair of stacks) and 4.8 x 10^-5g/m² day (4 pair of stacks). This result indicated that the permeation barrier films prepared by ICP-PECVD could be a promising candidate for flexible electronic applications.

• Periodical: Materials Science Forum (Volume 848)
• Pages: 435-439
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.848.435
• Online since: March 2016
• Authors: Jian Liu, Jie Liu, Xing Long Leng, Fu Rong Qu
• Keywords: Encapsulation, Organic Electronic, Organic/Inorganic Alternative Structure, PECVD

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