Modulation of Tribological Performance of Copper by Chemical Modification with H₂O₂/HCl Mixture

Abstract:

Tribological performance of materials is governed by their surface properties. The capacity to rationally design the surface physico-chemical cues of materials is thus a fundamental prerequisite to confer enhanced lubrication. The present study illustrated that the surface topological and chemical features on copper, which are expected to impact its tribological performance, can be easily modulated by varying the etchant’s concentration. The modified submicron and nanotextured surfaces on copper were characterized by scanning electron microscopy. Their tribological performance was evaluated by ball-on-disk tribometer measurements tester under both the dry and lubricating conditions.

• Periodical: Materials Science Forum (Volume 849)
• Pages: 716-724
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.849.716
• Online since: March 2016
• Authors: Lei Cao, Zhuo Jun Sun, Hai Jun Lin, Yong Wan, Jian Guo Gao
• Keywords: Chemical Etch, Chemical Modification, Copper, Friction

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