Effect of Solution Treatment on Microstructure Evolution and Mechanical Behavior of Cu-20Ni-20Mn Alloy

Abstract:

The influence of solution treatment on microstructure evolution and mechanical behavior of Cu-20Ni-20Mn alloy was investigated by optical microscopy (OM), X-ray diffraction (XRD) and hardness test. The results revealed that both solution temperature and holding time had effect on the grain growth behavior. The grain growth activation energy was determined by grain size of Cu-20Ni-20Mn alloy for different heat treatment temperatures and periods. With increasing temperature of solution treatment, the second phase is gradually dissolved into the Cu-rich matrix, and the lattice parameter of the matrix solution treated at 1173K for 0.5 h was about 3.668 Å. The hardness of the solution-treated alloy was lower than that of hot forging, and the hardness value decreased with the increase of solution temperature, which may be attributed to grain size. The hardening ability, corresponding to the Hall-Petch relationship, decreased linearly with D^-1/2.

• Periodical: Materials Science Forum (Volume 850)
• Pages: 773-777
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.850.773
• Online since: March 2016
• Authors: Wei Bin Xie, Qiang Song Wang, Guo Liang Xie, Xu Jun Mi, Dong Mei Liu, Xue Cheng Gao, Yang Li
• Keywords: Cu-Ni-Mn Alloy, Hall-Petch Relationship, Microstructure, Solution Treatment

References

[1] A. Boegel, K. Ohla, H.R. Mueller, United States Patent, U.S. Patent 6, 811, 623B2. (2004).

[2] A.V. Bobylev, Microhardness of Cu-Ni-Mn alloy reduced by etching reagents, Met. Sci. Heat Treat. 2 (1960) 43-44.

DOI: 10.1007/bf00655592

[3] D. Rondot, J. Mignot, Etude du stade initial de la transformation structurale de l'alliage Cu-Ni-Mn 60, 20, 20, Acta Metall. 26 (1978) 217-222.

DOI: 10.1016/0001-6160(78)90121-9

[4] S. Shapiro, D.E. Tyler, R. Lanam, Phenomenology of precipitation in Copper-20 pct Nickel-20 pct Manganese, Metall. Trans. 11 (1974) 2457-2469.

DOI: 10.1007/bf02644029

[5] W.H. Sun, H.H. Xu, S.H. Liu, H.L. Chen, L.J. Zhang, B.Y. Huang, Experimental investigation and thermodynamic modeling of the Cu-Mn-Ni system , Calphad, 33 (2009) 642-649.

DOI: 10.1016/j.calphad.2009.07.003

[6] A. Lombardi, C. Ravindran, R. Mackay, Optimization of the solution heat treatment process to improve mechanical properties of 319 Al alloy engine blocks using the billet casting method. Mater. Sci. Eng. A 633 (2015) 125-135.

DOI: 10.1016/j.msea.2015.02.076

[7] Q. Miao, L.X. Hu, X. Wang, E.D. Wang, Grain growth kinetics of a fine-grained AZ31 magnesium alloy produced by hot rolling, J. Alloys Compd. 493 (2010) 87-90.

DOI: 10.1016/j.jallcom.2009.12.049

[8] F.J. Gil, J.M. Guilemany, Effect of cobalt addition on grain growth kinetics in Cu-Zn-Al shape memory alloys, Intermetallics 6 (1998) 445-450.

DOI: 10.1016/s0966-9795(97)00090-3

[9] M. Hillert, On the theory of normal and abnormal grain growth, Acta Metall. 13 (1965) 227-38.

[10] N. Saunders, A.P. Miodownlk, The Cu-Sn (Copper-Tin) system, Bulletin of Alloy Phase Diagrams 11 (1990) 278-287.

DOI: 10.1007/bf03029299

[11] A. Loucif, R.B. Figueiredo, T. Baudin, F. Brisset, R. Chemam, T.G. Langdon, Ultrafine grains and the Hall-Petch relationship in an Al-Mg-Si alloy processed by high-pressure torsion, Mater. Sci. Eng. A 532 (2012) 139-145.

DOI: 10.1016/j.msea.2011.10.074

[12] P. Lehto, H. Remes, T. Saukkonen, H. Hänninen, J. Romanoff, Influence of grain size distribution on the Hall-Petch relationship of welded structural steel, Mater. Sci. Eng. A 592 (2014) 28-39.

DOI: 10.1016/j.msea.2013.10.094

[13] A.V. Shatov, S.S. Ponomarev, S.A. Firstov, Modeling the effect of flatter shape of WC crystals on the hardness of WC-Ni cemented carbides, Int. J. Refract. Met. H. 27 (2009) 198-212.

DOI: 10.1016/j.ijrmhm.2008.07.008

[14] M. Furukawa, Z. Horita, M. Nemoto, R.Z. Valiev, T.G. Langdon, Microhardness measurements and the hall-petch relationship in an Al-Mg alloy with submicrometer grain size, Acta Mater. 44 (1996) 4619-4629.

DOI: 10.1016/1359-6454(96)00105-x

[15] R. Armstrong, I. Codd, R.M. Douthwaite, N.J. Petch, The plastic deformation of polycrystalline aggregates, Philos. Mag. 7 (1962) 45-58.

[16] H.B. Huang, F. Spaepen, Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers, Acta mater. 48 (2000) 3261-3269.

DOI: 10.1016/s1359-6454(00)00128-2

[17] M. Hakamada, Y. Nakamoto, H. Matsumoto,H. Iwasaki, Y.Q. Chen, H. Kusuda, M. Mabuchi, Relationship between hardness and grain size in electrodeposited copper films, Mater. Sci. Eng. A 457 (2007) 120-126.

DOI: 10.1016/j.msea.2006.12.101