The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method

Abstract:

The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful SnPb solders. The effects of Zn addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder were investigated with 1 wt% and 5 wt% of Zn additions. Powder metallurgy (PM) method was used to fabricate these Sn-0.7Cu-Zn lead-free solders. The results revealed that the addition of Zn was able to improve the solder properties. The melting point of Sn-0.7Cu-Zn lead-free solder was decreased drastically as the increasing of Zn additions. The Zn particles were distributed homogenously along the grain boundaries and produced refined dendrite β-Sn, which also lead to a superior microhardness values of solders.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 13-17
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.13
• Online since: May 2016
• Authors: Nisrin Adli*, Nurul Razliana Abdul Razak, Norainiza Saud
• Keywords: Lead-Free Solder, Melting Point, Microhardness, Microstructure, Powder metallurgy

References

[1] M. Kamal, and E. S. Gouda: Journal Materials Science: Material Electron, Vol. 19 (2008), pp.81-84.

[2] E. Siahaan, B. Soegijono, and M. Hikam: International Journal of Basic & Applied Sciences, Vol. 14 (2014), pp.17-20.

[3] A.A. El-Daly, and A.E. Hammad: Journal of Alloys and Compounds, Vol. 509 (2011), p.8554–8560.

[4] J. W. Evans, in: A Guide to Lead-free Solders: Physical Metallurgy and Reliability, 1st Edition, Springer-Verlag, London (2006).

[5] M. J. Rizvi, C. Bailey, Y. C. Chan, and H. Lu: Electronics System-Integration Technology Conference, Vol. 1 (2006), pp.145-151.

[6] H. R. Kotadia, P. D. Howes, and S. H. Mannan: Microelectronics Reliability, Vol. 54 (2014), p.1253–1273.

[7] J. M. Eric, in: Fundamentals of Materials Science: The Microstructure-Property Relationship Using Metals as Model Systems, 1st Edition, University of Stuttgart Heisenbergstr, Germany (2010).

[8] S. Jun, L. Yongchang, W. Dongjiang and G. Houxiu: J. Mater. Sci. Technol., Vol. 22 (2006), pp.529-532.

[9] K.J. Puttlitz and K. A Stalter: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Marcel Dekker, Inc., New York 2004).

DOI: 10.1201/9780203021484

[10] A. A. El-Daly, A. E. Hammada, G. S. Al-Ganainy, and M. Ragab: Journal of Alloys and Compounds, Vol. 614 (2014), p.20–28.

[11] A. A. El-Daly, and A. M. El-Taher: Materials & Design, Vol. 47 (2013), pp.607-614.