The Alloying and Aging Effects on the Wettability and Intermetallic Bonding of the Sn-Zn-Cu-Bi Soldering Alloy on a Cu Substrate

Abstract:

The soldered bonding between the Sn-Zn-Cu-Bi system and a Cu substrate was studied and reported herein. The alloying compositions were varied to investigate the effects of Zn, Cu, Bi contents on the solders’ melting temperature (T_m), microstructures, wettability and the intermetallic-compound (IMC) bonding with a Cu substrate. The Sn-7Zn and Sn-9Zn exhibited low T_m (198 °C), but poor wettability on the Cu substrates. Both Cu and Bi additions significantly improved the solder wettability. However, the T_m of the Sn-Zn-Cu series increased sharply to about 225 °C by the addition of 4-wt% Cu. The addition of 3-wt% Bi lowered T_m of the Sn-Zn-Cu alloys by 5 °C. The thickness of the IMC layers between solder and substrate was maximum for Sn-9Zn and significantly decreased with the Cu addition. With the addition of Bi to Sn-Zn-Cu, the IMC thickness increased. The aging of 150 °C for 150 hours minimally affected the IMC-bonding thicknesses of most samples; however, micro crack could be observed along the aged IMC layers.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 26-30
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.26
• Online since: May 2016
• Authors: Surakan Sunyadeth, Pun Wirot, Boonrat Lohwongwatana, Ratchatee Techapiesancharoenkij*
• Keywords: Aging Effect, Intermetallic Compounds, Sn-Zn-Cu-Bi Lead-Free Solder, Wetting Angle

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