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HomeMaterials Science ForumMaterials Science Forum Vol. 857Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni...

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

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Abstract:

The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu₆Sn₅ growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.

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Advanced Materials Engineering and Technology IV

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Periodical:

Materials Science Forum (Volume 857)

Pages:

44-48

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.857.44

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Online since:

May 2016

Authors:

Christopher M. Gourlay*, Zhao Long Ma, Jing Wei Xian, Sergey A. Belyakov, Mohd Arif Anuar Mohd Salleh, Guang Zeng, Hideyuki Yasuda, Kazuhiro Nogita

Keywords:

Cu₆Sn₅, EBSD, Intermetallic, Nucleation, Pb-Free Soldering, Synchrotron

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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