Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling

Article Preview

Abstract:

Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

36-39

Citation:

Online since:

May 2016

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2016 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] W.W. Lee, L.T. Nguyen, G. S: Microelectron. Reliab. Vol. 40 (2000), pp.231-244.

Google Scholar

[2] H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green, S.H. Mannan: J. Alloys Compd. Vol. 511 (2012), p.176– 188.

Google Scholar

[3] E. Hodulova, M. Palcut, E. Lechoviˇc, B. ˇSimekova, K. Ulrich: J. Alloys Compd. Vol. 509 (2011), p.7052–7059.

Google Scholar

[4] Feng-Jiang Wang, Zhi-Shui Yu, Kai Qi: J. Alloys Compd. Vol. 438 (2007), p.110–115.

Google Scholar

[5] J. Mi, Y. -F. Li, Y. -J. Yang,W. Peng, H. -Z. Huang: The ScientificWorld Journal (2014), pp.1-11.

Google Scholar

[6] M. Ling, A. Perry: J. Alloys Compd. Vol. 529 (2012), p.173–180.

Google Scholar

[7] C. Tekmen, I. Ozdemir, E. Celik: J. Surf Coat. Techn. Vol. 174 – 175 (2003), p.1101–1105.

Google Scholar

[8] L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye: J. Alloys Compd. Vol. 510 (2012), p.38– 45.

Google Scholar

[9] H.L.J. Pang, K.H. Tan, X.Q. Shi, Z.P. Wang: J. Mater. Sci. Eng. A Vol. 307 (2001), p.42–50.

Google Scholar

[10] Y. -Y. Shiue, T. -H. Chuang: J. Alloys Compd. Vol. 491 (2010), p.610–617.

Google Scholar

[11] J.H.L. Pang, T.H. Low, B.S. Xiong, Xu Luhua, C.C. Neo: Thin Solid Films Vol. 462 (2004), p.370– 375.

DOI: 10.1016/j.tsf.2004.05.092

Google Scholar

[12] Chi-Yang Yu, Jenq-Gong Duh: J. Mater Sci Vol. 47 (2012), p.6467–6474.

Google Scholar