Suppression of Cu3Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

Kazuhiro Nogita; Benjamin Kefford; Jonathan Read; Stuart D. McDonald

doi:10.4028/www.scientific.net/MSF.857.53

Paper Titles

Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling
p.36

Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage
p.40

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders
p.44

Effects of Trace Phosphorus in Sn-Cu-Ni Wave Solder Dross
p.49

Suppression of Cu₃Sn with Ni in High Cu Containing Sn-Cu Solder Alloys
p.53

Peritectic Reactions and Phase Transformations of Sn-30wt%Cu for High Temperature Pb-Free Soldering Applications
p.58

XPS Analysis of Oxide Films on Lead-Free Solders with Trace Additions of Germanium and Gallium
p.63

Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO₂) Particles
p.68

Surface Roughness and Wettability of SAC/CNT Lead Free Solder
p.73

HomeMaterials Science ForumMaterials Science Forum Vol. 857Suppression of Cu3Sn with Ni in High Cu Containing...

Suppression of Cu₃Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

Abstract:

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu₃Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu₃Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu₃Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu₃Sn and Cu₆Sn₅, slowing the growth of Cu₃Sn and encouraging primary Cu₆Sn₅ nucleation.

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Materials Science Forum (Volume 857)

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53-57

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.857.53

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Online since:

May 2016

Authors:

Kazuhiro Nogita*, Benjamin Kefford, Jonathan Read, Stuart D. McDonald

Keywords:

Cu₃Sn, Cu₆Sn₅, High Temperature Solders, Solidification

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