Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO₂) Particles

Abstract:

In this paper, Sn-0.7Cu composite containing weight percentage of 1.0 wt. % of titanium oxide (TiO₂) particles were successfully fabricated by using the powder metallurgy (PM) route assisted hybrid microwave sintering. This research investigated the effect s of TiO₂ particles addition on the interfacial reactions formed between Sn-0.7Cu solder/substrate and shear strength of a Sn-0.7Cu solder alloy. With the increasing of TiO₂ particles, Sn-0.7Cu-TiO₂ composite solder showed decreasing in thickness value and shear strength was increased. This signified that the presence of TiO₂ particles effect on the thickness of Cu₆Sn₅ IMC layer at the interface and mechanical properties Sn-0.7Cu composite solder joint.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 68-72
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.68
• Online since: May 2016
• Authors: Norhayanti Mohd Nasir, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree B. Derman, Mohd Izrul Izwan Ramli, Rita Mohd Said
• Keywords: IMC Thickness, Lead-Free Composite Solder, Powder metallurgy, Shear Strength, Soldering Alloy, Titanium Oxide

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