Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond

Abstract:

The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 83-86
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.83
• Online since: May 2016
• Authors: Roslina Ismail, Fuaida Harun, Azman Jalar*, Shahrum Abdullah
• Keywords: Au Wedge Bond, Bondability, Ultrasonic Vibration, Wire Bonding

References

[1] Tummala, R.R., 2001. Fundamentals of Microsystems Packaging, McGraw-Hill, New York, pp.311-312.

[2] Zulkifli, M.N., Abdullah, S., Othman, N.K., Jalar, A., 2012. Some thoughts on bondability and strength of gold wire bonding. Gold Bull. 45, 115-125.

DOI: 10.1007/s13404-012-0060-y

[3] Zhong, Z.W., 2009. Fine and ultra-fine pitch wire bonding: challenges and solutions. Microelectron. Int. 26, 10-18.

DOI: 10.1108/13565360910960187

[4] Qi, J., Hung, N.C., Li, M., Liu, D., 2006. Effects of process parameters on bondability in ultrasonic ball bonding. Scripta Mater. 52, 293-297.

DOI: 10.1016/j.scriptamat.2005.07.042

[5] Lum, I., Jung, J.P., Zhou, Y., 2005. Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate. Metall. Mater. Trans. A. 36A, 1279-1286.

DOI: 10.1007/s11661-005-0220-2

[6] Saiki, H., Marumo, Y., Nishitake, H., Uemura, T., Yotsumoto, T., 2006. Deformation analysis of Au wire bonding. J. Mater. Process. Tech. 177, 709-712.

DOI: 10.1016/j.jmatprotec.2006.04.024

[7] An, B., Ding, L., Wang, T., Lu, T., Sun, L., Wu, Y., 2011. Improvement of the second bond strength in copper wire bonding on pre-plated leadframe, IEEE 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, p.1.

DOI: 10.1109/icept.2011.6066860

[8] Shah, A., Mayer, M., Zhou, Y., Hong, S.J., Moon, J.T., 2008. In situ ultrasonic force signal during low-temperature thermosonic copper wire bonding. Micron. Eng. 85, 851-1857.

DOI: 10.1016/j.mee.2008.05.035

[9] Qin, I., Shah, A., Huynh, C., DeAngelis, D., Meyer, M., Mayer, M., Zhou, Y., 2010. Thermosonic Au Ball Bonding Process Investigated using Microsensor and Laser Vibrometer, IEEE 2010 Proceeding 60th Eelectronic Components and Technology Conference (ECTC), Las Vegas, pp.1776-1782.

DOI: 10.1109/ectc.2010.5490729

[10] Zhong, Z.W., Goh, K.S., 2006. Investigation of ultrasonic vibrations of wire-bonding capillaries. Microelectr. J. 37, 107-113.

DOI: 10.1016/j.mejo.2005.04.045

[11] Li, J., Han, L., Duan, J., Zhong, J., 2007. Microstructural characteristics of Au/Al bonded interfaces. Mater. Charact. 58, 103-107.

DOI: 10.1016/j.matchar.2006.03.018

[12] Hibbeler, R.C., 1997. Engineering Mechanics: Dynamics, Prentice Hall, New Jersey, pp.150-151.