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HomeMaterials Science ForumMaterials Science Forum Vol. 857Wettability of Soldering Alloys at Heating by...

Wettability of Soldering Alloys at Heating by Electron Beam

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Abstract:

The aim of research consisted in the study of wettability of Sn-based solders on ceramic Al₂O₃ material by heating with electron beam without flux application. The Sn-based solders alloyed with active elements as Ti, La, Ce and Ga were applied for soldering. The active elements contained in solder volume oxidise during soldering in air. This problem can be eliminated by application of electron beam in vacuum. Soldering consisted of 15 minutes heating to desired temperature then dwelling on this temperature for 5 minutes and a slow cooling down in vacuum. The desired soldering temperature was 950 °C. The best wettability on Al₂O₃ substrate was achieved with SnAg3,5Ti4(Ce,Ga) solder, with wetting angle of 62°. The interactions between the solder and substrate were identified in the joint interface, ensuring the creation of a stable bond.

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Advanced Materials Engineering and Technology IV

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Periodical:

Materials Science Forum (Volume 857)

Pages:

87-92

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.857.87

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Online since:

May 2016

Authors:

Roman Koleňák, Igor Kostolný, Daniel Dřímal, Andrej Rabatin

Keywords:

Electron Beam, Sn Solders, Soldering, Wetting

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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