Wettability of CNT-Doped Solder under Isothermal Aging

Abstract:

Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01%, 0.02%, 0.03% and 0.04% carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0,200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04% CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04% of CNTs.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 76-78
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.76
• Online since: May 2016
• Authors: Norliza Ismail, Roslina Ismail, Nur Izni Abd Aziz, Azman Jalar*
• Keywords: Carbon Nanotube, Isothermal Aging, Sn-Ag-Cu, Wettability

References

[1] Liu X.D., Han, Y.D., Jing H.Y., Wei,J., Xu,L.Y., Effect of graphene nano sheets reinforcement on the performance of Sn–Ag–Culead- free solder, Materials Science & Engineering A 562 (2013) 25–32.

DOI: 10.1016/j.msea.2012.10.079

[2] Krystyna,B., Marek,K., Janusz,S., Malgorzata,J. &Anna,M., Properties of SAC solder paste with different nanoparticles. 34th Int. Spring Seminar onElectronics Technology, IEEE. (2011) 537-541.

[3] Morris, J.E. 2008. NanopackagingNanotechnologies and Electronic Packaging. United States of America. Springer Science + Business Media.

[4] Nai, S.M. L, Wei, J. & Gupta, M., Lead-free Solder Reinforced with Multiwalled Carbon Nanotubes, Journal of Electronic Materials. Vol. 35(7) (2006) 1518-1522.

DOI: 10.1007/s11664-006-0142-9

[5] Han,Y., Jing,H., Nai S.M.L., Xu,L.Y., Tan C.M., &Wei,J., Effect of Ni coated carbon nanotubes on interfacial intermetallic layer growth. ElectronicsPackaging Technology Conference, (2009) 292-295.

DOI: 10.1109/eptc.2009.5416534

[6] John, W.E. 2007. A guide to Lead-free Solders : Physical Metallurgy and Reliability. United States of America. Springer Science + Business Media.

[7] Han, Y.D., Tan C.M., Nai, S.M.L., Xu,L.Y., Jing H.Y. & Wei,J., Effect of Ni-Coated Carbon Nanotubes on the Microstructure and Properties of Sn-Ag-Cu Solder. Electronic Components and Technology Conference, (2010) 979-984.

DOI: 10.1109/ectc.2010.5490658

[8] Wu, C.M.L., Properties of Lead Free Solder Alloys with Rare Earth Element Additions, Materials Science and Engineering R 44 (2004) 1-44.

DOI: 10.1016/j.mser.2004.01.001

[9] Karl, J.P. 2004. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. United States of America. Marcel Dekker, Inc.

[10] Yang, Z, Wei, Z and Ping,W. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn-Ag-Cu solder joints. Journal of Alloys and Compounds 581 (2013) 202-205.

DOI: 10.1016/j.jallcom.2013.07.058